On behalf of the International Scientific Committee and the Local Organizing Committee, we cordially invite you to participate in the

18th International Conference on the Strength of Materials (ICSMA 18)

July 15–19, 2018 • The Ohio State University • Columbus, Ohio, USA

Register Now
Register by April 30, 2018, to take advantage of the Early Bird discounted rates.

Abstract Deadline:
January 15, 2018

Discount Registration Deadline:
June 15, 2018

On-Campus Housing Deadline:
July 6, 2018

Conference Dates:
July 15–19, 2018


ICSMA 18 builds on a 50-year tradition of providing an international venue for the latest advances in the strength of materials. Scientific topics provide comprehensive coverage of the field, from basic concepts of deformation to advanced engineering materials, and across composites, alloys, biomedical and bio-inspired materials, and emerging materials. The meeting will advance fundamental understanding of the processes that govern the strength of materials at different length and time scales, and it will forge links between basic studies and investigations of technologically important engineering materials. Thus, ICSMA 18 will offer a broad forum for the presentation and discussion of all aspects related to the strength and deformation of a wide range of materials. The conference will be held at The Ohio State University (USA), providing an open campus setting in which to meet.

ICSMA 18 will take place at the Ohio Union (above) on the campus of The Ohio State University in Columbus, Ohio, USA.

ICSMA 18 will begin on the evening of Sunday, July 15 with a an opening reception and conclude on the evening of Thursday, July 19 with a closing banquet. Each weekday morning will begin with a plenary session and transition to six concurrent sessions, all held in the convenience of the Ohio Union, a state-of-the-art meeting space integrated with restaurants and shopping along the High St. commercial district. Please see Special Events for information on networking and special events throughout the week.

Topic areas include:

  • Advanced (including in situ) characterization of deformation processes
  • Elementary deformation mechanisms in engineering materials
  • Fracture and fatigue
  • Friction and wear
  • Glasses and non-crystalline solids
  • High temperature deformation and creep
  • Materials under extreme conditions
  • Mechanical behavior associated with phase transformations
  • Mechanistic foundations for multiscale modeling and ICME
  • Micro-and nano-scale mechanical testing
  • Effects of grain boundaries and interfaces
  • Reinforcements at the sub-nanometer scale
  • Strength of biomedical and bio-inspired materials
  • John P. Hirth Honorary Symposia
  • Hael Mughrabi Honorary Symposia
  • Emerging topics

Confirmed Plenary Speakers Include:

Laurence Brassart, Australia
Micromechanics of Highly Cross-linked Thermosets
Easo George, USA
Mechanical Behavior of High Entropy Alloys
Dorte Juul-Jensen, EU
Metal Microstructures and Properties in 3D and 4D
Carolin Koerner, EU
Additive Manufacturing
Erica Lilleodden, EU
Extreme Strength: Achieving Extraordinary Strengths by Varying Length Scales and Boundary Conditions
Ke Lu, China
Hardening and Softening in Nano-grained Metals
Dierk Raabe, EU
Advancing Steels by Segregation Engineering
Kaneaki Tsuzaki, Japan
Designing Microstructures to Improve Fatigue Property in Steels

Local Organizing Committee:

  • Peter Anderson, The Ohio State University
  • Irene Beyerlein, University of California, Santa Barbara
  • James Earthman, University of California, Irvine
  • Michael Mills, The Ohio State University
  • Timothy Rupert, University of California, Irvine
  • Izabela Szlufarska, University of Wisconsin

International Scientific Committee:

  • Helena Van Swygenhoven, Switzerland - CHAIR
  • Angus Wilkinson, UK - VICE CHAIR
  • Irene Beyerlein, USA
  • Cate Brinson, USA
  • Atul Chokshi, India
  • Antonin Dlouhy, Czech Republic
  • Chris Hutchinson, Australia
  • Yuichi Ikuhara, Japan
  • Martin Heilmeier, Germany
  • Marc Legros, France
  • Michael Mills, USA
  • Wolfgang Pantleon, Denmark
  • Maria-Teresa Perez-Prado, Spain
  • Reinhard Pippan, Austria
  • Tresa Pollock, USA
  • Alexei Romanov, Russia
  • Chad Sinclair, Canada
  • Werner Skrotzki, Germany
  • Zhefang Zhang, China

Ohio Union

View of Oval

OSU Emblem

William Oxley Thompson Library

Campus Map

Send Me More Information

Click the button above and fill out the form if you are interested in receiving e-mail updates on ICSMA 18.


Thank you to the sponsors of ICSMA 18:

The Institute for Materials Research is Ohio State’s gateway to materials research innovation.

For More Information

For more information about this meeting, please contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000, ext. 241
Fax: 1-724-776-3770